2026 the 9th International Conference on Smart Materials Applications (ICSMA 2026)

ICSMA2026 @ Tokyo, Japan


Welcome to the official website of2026 the 9th International Conference on Smart Materials Applications (ICSMA 2026). The Conference will be held atTokyo University of Science, Tokyo, Japan during January 28-30, 2026. ICSMA2026 is co-organized by South Asia Institute of Science and Engineering (SAISE); Tokyo University of Science, Japan; Yonsei University, South Korea and Sichuan University, China. The conference program covered invited, oral, and poster presentations from scientists working in similar areas to establish platforms for collaborative research projects in this field. This conference will bring together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations and to spark new ideas, with the aim of developing new projects and exploiting new technology in this field.

All submissions will be peer reviewed, the registered and presented papers will be published into Conference Proceedings, Indexed byElsevier: SCOPUS.
a.TTP_template.docb.Abstract-Template.docOnly Full paper submission will be published in conference proceedings if accepted.
Click on the following link URL :http://confsys.iconf.org/submission/icsma2026