THERMINIC 2026
0 days left — deadline over. Submissions closed on 1 April 2026. Registration may still be open.
Conference details
- StartsWednesday, 16 September 2026
- EndsFriday, 18 September 2026
- Submission deadline 1 April 2026 Closed
- Location Berlin, Berlin, Germany
- FormatConference
- Organisermcc
- ContactConference Office — admin@conferencesked.com
- Official site therminic.eu/submissions/
- Verification Unverified We could not confirm this listing. Verify before paying.
About this conference
Conference Topics: Thermal Phenomena in Simulation & Experiment Electronics Cooling Concepts & Applications Thermo-Mechanical Reliability
Highlights
<b>Submissions | THERMINIC</b><br/><br/><br/>The 32ndInternational Workshop on Thermal Investigations of ICs and Systems seeks original, noncommercial papers describing research and innovations related to thermal and reliability issues in electronic components and systems. Authors are invited to submit an abstract describing recent work. Abstracts must detail the objectives of the work presented and demonstrate new results.<br/>Thermal Phenomena in Simulation & Experiment:<br/>Electronics Cooling Concepts & Applications:<br/>Thermo-Mechanical Reliability<br/>Please use the provided template for your abstract. The abstract should not exceed two pages and should be uploaded as a PDF file. The online system for abstract submission will open in December 2025. All abstracts will undergo a double-blind review process.
Getting there
Berlin, Berlin, Germany. Open in Google Maps
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